5170-IH

5170-IH is the handler to test the leadless devices such as QFN,BGA and WLCSP diced on the wafer ring. It is capable of hot and cold temperature test. The stable testing and high speed indexing of the devices on the ring are supported by precise device positioning information and optimized probe-pin contact pressure that are ensured by the positioning (x, y, z, θ) compensation before testing with visual inspection system.

Feature

・High throughput 
・High withstand load and high thrust table 
・Maximum Strip Attachment Area: 300 mm(L) × 300 mm(W) [⌀300 mm for WLCSP]
・LOT control with barcode/2D code reader 
・Easy device type conversion — test socket replacement and display screen setting
・Auto-cleaning function of socket with programmable timing
・6/8/12 inches ring conversion 
・SEMI S2/S8 compliant
・SEMI G85 compliant
・SECS/GEM compliant
・Highest test temperature: 155℃
・Lowest test temperature: −45℃
・Upgrade from the ambient temperature system to the temperature control system is available at the installed location.