TES Corporation established in Higashiyamato, Tokyo with a paid-up-capital of JPY 1 million.

Wire Bonder, Discrete Device Tester, and Discrete Device Handler developed.

Corporate Headquarters moved to Kamikitadai, Higashiyamato, Tokyo.

Hot Handler for discrete device developed.

IC Handler developed.

Thermal Resistance Tester developed.

Marking Machine developed.

TES Corporation changed its name to TESEC Corporation.

Ina Factory opened in Minowamachi, Kami-ina, Nagano.

TESEC EUROPE Office opened in Cergy, France.

Thermal Resistance Tester for GaAsFET developed.

TESEC USA Office opened in Connecticut, USA.

TESEC (M) SDN.BHD. opened in Kuala Lumpur Malaysia.

SO/DIP Handler and Laser Marking Machine developed.

TESEC USA Office changed its name to TESEC, INC.

TESEC SEMICONDUCTOR EQUIPMENT (SINGAPORE) PTE.LTD. opened in Kallang Bahru, Singapore （closed in 2003）.

TESEC EUROPE Office changed its name to TESEC EUROPE S.A.

Discrete Device Tester controlled with MS-Windows developed.

SOT23 Integrated System developed.

High Speed Tri-temp. Handler developed.

SOP Handler and QFP Handler developed.

Integrated System for photo-coupler developed.

Discrete Device Parallel Tester and Integrated System for power devices developed.

Small Signal Device Tester, High Speed SOT23 Handler, and High Speed QFP Handler developed.

Obtained ISO9001. (UKAS, RVA)

CSP Handler, MAP System, and IC Tester developed.

Listed its shares on the over-the-counter market of the Japan Securities Dealers Association (JASDAQ) with a paid-up-capital of JPY 2.5 billion.

SOT23 New Integrated System, and Dynamic Test System developed.

Expansion of headquarters factory completed.

Formed business units for each product category by integrating R&D, engineering and sales & marketing groups.

Announced managerial creed and code of conduct.

High Speed TSSOP Handler and High Speed Power Device Handler with Taping Unit developed.

High Speed CSP MAP Picker developed.

High Speed SOT Handler with Taping Unit developed.

TESEC CHINA (Shanghai) CO., LTD. opened in Shanghai, CHINA.

TESEC Kumamoto Office opened in Mashiki, Kamimashiki, Kumamoto.

1000th Discrete Device Test System 881-TT shipped.

Small signal high speed handler developed

ISO 14001(UKAS) acquisition.

Merged the Tesec Service Corporation.

High speed picker handler system developed.

Tesec obtained the Handler business ownership transferring from Yokogawa Electric Corporation.

TESEC EUROPE S.A.S.U. ceased operations.

Stock exchange listing is changed from JASDAQ to OSAKA stock exchange bourse due to merger.

OSAKA security exchange Hercules market & JASDAQ stock exchange market.

Stock list on OSAKA JASDAQ (Standard) due to NEO market unification.

Tri-temperature power device handler developed.

Tesec Inc office (Connecticut/USA) moved to California/USA

Stock is listed on the Tokyo stock exchange bourse JASDAQ (Standard)
due to the merger of the Tokyo stock exchange bourse and Osaka stock exchange bourse.

MEMS handler developed.

Received TPEC Constellation Award.

Jointly developed "Fortia" power device measurement system with ACCRETECH

Celebrates 50th anniversary

Developed Tri-Temp MAP handler

･Development of Tri-Temp TAB handler

･Acquired CASBEE real estate evaluation certification (S rank) for the head office building

listed on the Tokyo Stock Exchange Standard Market
due to the revision of the market classification of the Tokyo Stock Exchange